LY M770 BGA Rework station for repair mobilephone

Volume Retail sales 1
Original Price US $362.00
Discount 6%
Last Price US $340.28

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14.606.98112.00352.243050.005.0095.0052.80

LY M770 BGA Rework station

The parameters and performance indicators:

1. The rework station suitable for notebook computer motherboard, desktop computer motherboards, computer and server motherboard, motherboard, motherboard, large game machines, communications equipment, motherboards, LCD TV motherboard, motherboard, print circuit board repair.

2. The BGA chips rework station can be very effective in replacing the stack memory, the replacement of the BGA chip, memory below will not take slurry.

3. The rework station can be very successful in solving BGA chip heated foaming problem. (constant temperature 100 degrees available preheating.

4. Preheat to repair the motherboard 1-2 minutes. Then heating.

5. The rework station can replace CPU notebook memory slot to facilitate the.

6. BGA chip to be an easy job to replace glue sealing, sealing glue chip to the rubber (hot-air or in addition to adhesive glue).

7. The replacement of the BGA chip, the circuit board can not turn yellow.

8. The rework station using infrared preheating and infrared heating, lower preheating station, PCB board for preheating, ensure that the PCB plate can not be deformed, preheating station area of 245*180. Can fully meet the desktop and notebook computer repair.

9. Rational design of support structure, the replacement of the BGA chip is not deformation, very convenient and practical.

10. The rework station can do circuit board drying and circuit board shaping.

·Dimensions: length 410MM* · outside the machine width 360MM* height 400MM

· the use of power: 220V50HZ

· machine power: 1450W

machine weight: 12 kg

The rework station welding success rate is almost 99%, if can\'t achieve this goal, probably because of the new machine, please try it a few times.

Rework station operations guide:

1, the motherboard in the preheating stage, the board fixed bracket.

2, the welding joint alignment chip from the chip 10MM, welding head, with a chip on the temperature probe.

3, open the preheat switch, to lead the chip preheating temperature set at 280 degrees, to preheat the motherboard, the motherboard preheating time needed for more than ten minutes, then open the welding joint, the welding of the chip, the upper temperature controller temperature set to 220 degrees (three temperature zones lead-free please refer to the following temperature open the settings) welding welding switch as long as 150 seconds to complete chip.

4, close the heating switch, a lower preheating switch, remove the welding head to the motherboard, after cooling, can move the motherboard.

5, open the cross-flow fan, heat dissipation on the motherboard, about heat about 2 minutes can remove the motherboard, power off.

Have the relevant knowledge and welding:

How much is the lead solder and lead-free solder melting point respectively?

Lead solder melting point of 183 degrees, lead-free solder melting point of 217 degrees

Can be directly welded. The first to chip into the amount of flux or pine, then heating.

If welding is not successful, will need to take down the redo BGA chip.

How will the pad alignment of BGA chip and the circuit board?

There are corresponding to the BGA chip line on the circuit board, the BGA chip and the frame alignment can be placed.

For the ball more than 0.65mm spacing of BGA chip, the direct use of manual alignment can be, without the need for optical equipment with the help of professional. Such as notebook computer board, desktop computer motherboards, computer boards, server board, large and medium-sized game board

For BGA chip underfill encapsulant below 0.5mm, often need to resort to the accurate alignment of optical devices. For example, LED lamp.

Notebook computer pad spacing have how old? Solder ball notebook computer is how much?

Pad spacing notebook computer has three kinds: 1.27mm 1mm 0.8mm

Solder ball notebook computer application has three kinds: 0.76mm 0.6mm 0.5mm

The spacing of 1.27mm chip using 0.76mm solder ball

The spacing of 1mm chip using 0.6mm solder ball

The spacing of 0.8mm chip using 0.5mm solder ball

X machine can detect the BGA chip is welded with?

X machine can accurately determine the fault solder adhesion.

For the problem of weld, X machine can not accurately judge.

For the chip overheating damage problem, X machine can not judge.

X machine in the price between 20-100 million.

To accurately determine whether the success of the most accurate way of welding is a functional test. Also is the power-on test circuit board can work normally.

What is the infrared heating?

Infrared ray is a ray of sun many invisible light, is located outside the red light, so called infrared. In the spectrum of wavelengths from a period of 0.76 to 400 microns called infrared, infrared thermal effect.

Infrared heating dazzling?

Infrared is not visible light, infrared not glare. Glare is often the incandescent lamp.

Specifications:

01. Applicable to laptop motherboard, desktop motherboard, XBOX-360, server motherboard, digital products etc..

02. Two heating zones, independant heating, upper heating 300W, bottom preheating 1600W

03. Maximum heating temperature : 500 degree

04. Used high accurate Intelligent temperature controller, make more accurate temperature controlling

05. Movable heater, easy and convinient to use

06. Infrared heating panel, independant controlling heating

07. Brilliant-designed Universal circuit board structural support, weld zone part non-support, none sink

08. Bottom preheater, used to preheat PCB, to make sure it non-deformation, maximum heating area 450 * 500mm

09. No limit for PCB thickness during desoldering

10. No limit for BGA chips size during desoldering, max size for 775CPU, min size for CCD grain

11. Dimension: L450 * W450 * H460mm

12. Power supply: 220V 5060Hz

13. Effective power: 1900W

14. Weight: 20kg

15. Factory bulk welding success rate up to 98%, machine warranty for 1 year

RE:Not support communication by software with Com.

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